SmartArea - System Integration Methods for Large Area Functional Surfaces

Save favourite 7 Dec December 2018
Stora ytor RFID Xiaotian Li STC

The SmartArea project aims to explore, develop, and evaluate novel hybridization technologies for electronics on non-conventional flexible materials over large areas. Researcher will together with partner companies investigate how to combine printed components and other functions on the same substrate, such as printed sensors or printed LEDs.

Abstact

A considerable amount of research has been aimed toward the development and fabrication of printed components, such as transistors, light-emitting devices (LEDs), as well as other printed components. However, the functionality and the performance of even the most inexpensive microprocessor or other advanced integrated circuits are, at the moment, out of reach by means of fully printed components. Therefore, to use hybrid printed electronics presents an interesting solution because of the low cost and high performance of standard components together with the benefits of printing technology. That is, flexible cellulose or plastic substrates acting as a carrier for components and for conductive. During the past 20 years a considerable amount of research has been aimed towards the development of technologies gathered within the general racks that in turn are fabricated from inks or thin metal sheets. In such case, it is thus also possible to combine printed components or other functions on the same substrate that carries standard surface mount devices, such as printed sensors or printed LEDs, even though printing semiconducting functionalities or advanced sensors is not within the scope of this specific project.

The SmartArea project aims to explore, develop, and evaluate novel hybridization technologies for electronics on non-conventional flexible materials over large areas. It is initially performed together with:

  • Skultuna Flexible, who are specialized in providing metallic foils carried by plastics or paper.
  • Atlas Print Group, who are skilled in printing electronic functionalities upon different materials.
  • Inission Triab, who are building up internal competence in industrial component mounting on nonconventional
    PCB-materials.

By using materials that is milder to the environment, recyclable, and renewable, as well as inexpensive STC and the partner companies together open up possibilities for applications previously not practically nor economically realizable.

Research group

Researchers

Johan Sidén
Project leader Johan Sidén, associate professor at STC

Project leader

Johan Sidén

Researchers

Henrik Andersson

 

Project period:

2017-03-01 - 2020-02-28

Funding

3 150 000 SEK from the Knowledge Foundation